Join us on zoom:
https://nyu.zoom.us/j/95167194438
Thursday, May 19th, 1:00 – 2:00pm
XPS became in the recent years one of the most important techniques when it comes to the analysis and characterization of solid surfaces and interfaces. XPS does provide beside the elemental composition of the outer most surface the chemical state information. This is key and very important in a number of industrial applications.
In this talk, an introduction to the surface analytical techniques will be given, and why XPS became such important over the years.
In XPS, the probing depth can be varied from only 0.1 – 10nm together with the possibility to perform localized analysis down to 10um. That combination enables XPS to address the key analytical questions relevant to develop new materials.
Beside the key strength of surface analysis, modern XPS instrumentation allow the use of in-situ etching for the removal of surface contaminants, the investigation of layered materials and to study diffusion phenomena. Depending on the thickness and composition of the material, different etching sources such as ultra-low energy monoatomic Argon sputtering, Argon Gas Cluster Beams (GCIB) or C60 Cluster Guns are used.
Examples of the successful analysis 2D and 3D analysis organic and inorganic material will be presented. Furthermore, the analyses of multilayered organic and in-organic films with thicknesses in the nanoscale regime will be discussed.
Wolfgang Betz:
Engineering degree in electrical engineering from University of Würzburg, Germany in 1985. From 1985-1990 Field service engineer at NICOLET instruments for FTIR instruments. In 1990 he joined Physical Electronics as a field service engineer for surface analysis equipment, focusing on XPS, Auger, Time-of-Flight SIMS and TXRF. Move into sales and marketing in 1995, where he held different positions for different regions. Currently, Wolfgang Betz is responsible for the sales and marketing activities in Europe, Middle East, Africa and India.